Pad X8b
Available. Announced 2026, February 13Brand
Honor
Announced
Feb 2026
Model
N/A
Chipset
Snapdragon 680
Full specifications
Network
Technology
GSM / HSPA / LTE
2G bands
GSM 850 / 900 / 1800 / 1900 - cellular model only
3G bands
HSDPA 900 / 2100 - cellular model only
4G bands
LTE - cellular model only
Speed
HSPA, LTE - cellular model only
Launch
Announced
2026, February 13
Status
Available. Released 2026, February 13
Body
Dimensions
256.9 x 168.5 x 7.3 mm (10.11 x 6.63 x 0.29 in)
Weight
496 g (1.09 lb)
Build
Glass front, aluminum frame, aluminum back
SIM
Nano-SIM
Display
Type
TFT LCD, 90Hz, 500 nits
Size
11.0 inches, 347.5 cm2 (~80.3% screen-to-body ratio)
Resolution
1200 x 1920 pixels, 16:10 ratio (~207 ppi density)
Platform
OS
Android 16, MagicOS 10
Chipset
Qualcomm SM6225 Snapdragon 680 4G (6 nm)
CPU
Octa-core (4x2.4 GHz Kryo 265 Gold & 4x1.9 GHz Kryo 265 Silver)
GPU
Adreno 610
Memory
Card slot
microSDXC
Internal
64GB 4GB RAM, 128GB 4GB RAM, 128GB 6GB RAM, 256GB 8GB RAM
Main Camera
Single
5 MP, f/2.0, AF
Features
HDR
Video
1080p@30fps
Selfie camera
Single
5 MP, f/2.0
Video
1080p@30fps
Sound
Loudspeaker
Yes, with stereo speakers (4 speakers)
3.5mm jack
No
24-bit/192kHz Hi-Res & Hi-Res Wireless audio
Comms
WLAN
Wi-Fi 802.11 a/b/g/n/ac, dual-band
Bluetooth
5.0, A2DP, LE
Positioning
No
NFC
No
Radio
No
USB
USB Type-C, OTG
Features
Sensors
Accelerometer
Battery
Type
Li-Ion 10100 mAh
Misc
Colors
Space Gray
Models
NDL2-W09
